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Self-Aligning and Flexible Dielectric Waveguide Plug for MMICs at G-Band

机译:用于G波段的MMICS自对准和柔性介质波导插头

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The packaging technology for transitions to dielectric waveguides in the frequency range above 100 GHz is complex and must be highly precise, and the waveguides are usually permanently connected. This letter presents a transition from a monolithic microwave integrated circuit (MMIC) to a flexible dielectric waveguide at G-Band (140-220 GHz), which is self-aligning and, thus, reduces the requirements for packaging accuracy. Furthermore, the transition is mechanically decoupled to avoid mechanical stress to the MMIC and to reconnect it arbitrarily often. A patch radiator on a quartz-glass carrier is excited by a coupler on the MMIC. It feeds the HE11 mode into a rigid, high-permittivity dielectric dome, which increases the coupling efficiency. The flexible dielectric waveguide is placed above the dome and fixed with Rohacell half shells. The minimum insertion loss measured with a back-end-of-line (BEOL) MMIC is 3.0 dB at 168 GHz.
机译:用于转换到100GHz高于100GHz的频率范围内的介电波导的包装技术是复杂的并且必须高度精确,并且波导通常是永久连接的。该字母呈现从单片微波集成电路(MMIC)到G波段(140-220GHz)的柔性电介质波导的过渡,这是自对准的,因此降低了包装精度的要求。此外,转变机械地分离以避免对MMIC的机械应力并经常重新连接。石英玻璃载体上的贴片散热器由MMIC上的耦合器激发。它将HE11模式送入刚性高介电常数圆顶,这增加了耦合效率。将柔性介电波导放置在圆顶上方并用Rohacell半壳固定。用后端线(BEOL)MMIC测量的最小插入损耗为168 GHz。

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