Method for assessing remaining life in electronic assemblies

摘要

A physics-of-failure based methodology is presented for determining the remaining life in electronic assemblies. The methodology has three steps. The first step is to conduct an analysis of the degradation in electronic assemblines resulting from their storage or use, in order to determine the potential failure mechanisms. The second step is to use physics-of-failure models for these mecahnisms to define test conditions and durations that produce similar damage as that expected in the intended application but in a much shorter time. The third step is to perform these accelerated tests on used and unused assemblies and to conduct subsequent failure/degradation analysis of the tested assemblies. This third step provides the inforamtion needed to determine if the assembly has sufficient life to survive in the intended application. This methodology is demonstrated by determining the remaining life of electronic assemblies operated intermittently in refrigerators.