Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process

摘要

This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film. The effects of three main sintering parameters, sintering temperature (220 to 300 degrees C), sintering time (1 to 9 s) and bonding pressure (6 to 25 MPa) on the resultant shear strength are investigated using uniform design and single factor experimental trials. The shear strength data series for each of the experimental trials was statistically analyzed to indicate any deviation from normal distribution. The resulting shear strength values were regressed or fitted, and further analyzed by polynomial and kinetic-like equations to estimate the relationship between the shear strength and sintering parameters. The regression analysis for shear strength may not only be used for explaining mass transportation mechanisms, but also for identifying the proposed manufacturability of the time-reduced sintering process.