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A regular fabric design methodology for applications requiring specific layout-level design rules

机译:针对需要特定布局级别设计规则的应用程序的常规结构设计方法

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Regular fabrics have been introduced as an approach to bridge the gap between ASICs and FPGAs in terms of cost and performance. Indeed, compared to an ASIC, by predefining most of the manufacturing masks, they highly reduce time-to-market, non-recoverable engineering costs and lithography hazards. Also, thanks to hardwired configuration and interconnections their performance is closer to those of ASICs than those of FPGAs. They are therefore well suited to many applications requiring low to medium volume applications or higher performance than those provided by FPGAs. In this paper, we evaluate the interest of using a regular fabric to reduce time and design cost significantly in applications involving specific transistor level design (radiative/spacial conditions, side-channel attacks, NMR environment, etc.). With this aim in view, after a broad state of the art overview with an emphasis on architectures and design flows, we develop our approach of a regular fabric designed to limit layout level design, ad-hoc tools and technological migration cost. Then, we evaluate its performance in a 65 nm process versus FPGA and standard cell based ASIC implementations. For sequential designs, our proposed solution is on average 2.5 × slower and 2.3 × bigger than a standard cell implantation, but also on average 13 × faster than a FPGA.
机译:引入常规结构作为一种在成本和性能方面缩小ASIC与FPGA之间差距的方法。实际上,与ASIC相比,通过预定义大多数制造掩模,它们可以极大地缩短产品上市时间,不可挽回的工程成本和光刻风险。此外,由于采用了硬接线配置和互连,其性能比FPGA的性能更接近ASIC。因此,它们非常适合许多要求中小批量应用或比FPGA提供更高性能的应用。在本文中,我们评估了在涉及特定晶体管级设计(辐射/空间条件,侧信道攻击,NMR环境等)的应用中使用常规结构来减少时间和显着降低设计成本的兴趣。鉴于此目标,在对结构和设计流程进行了广泛的最新介绍之后,我们开发了一种常规织物的方法,以限制布局级别的设计,临时工具和技术移植成本。然后,与基于FPGA和基于标准单元的ASIC实现相比,我们在65 nm工艺中评估其性能。对于顺序设计,我们提出的解决方案平均比标准单元植入慢2.5倍,大2.3倍,但比FPGA平均快13倍。

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