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机译:常压等离子体烧结Cu纳米膏的特性
SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea;
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea;
Department of Fine Chemical Engineering, Hanyang University, Ansan 426-791, Republic of Korea;
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea;
Copper nanopaste; Screen printing; Atmospheric-pressure plasma; Plasma sintering;
机译:高温固晶应用的Ag-Cu纳米膏烧结体的热学特性
机译:常压等离子体改性玻璃表面铜纳米膏的附着力改善
机译:Cu_(10)SN_3 IMCS纳米物作为高温电力电子材料的模具材料的制备和烧结性能
机译:PI丝网印刷银纳米膏的常压等离子体烧结
机译:通过火花等离子体烧结制备的致密立方晶Li 7-3xAlxLa3Zr2O7(x = 0.05-0.3)的电晶粒边界特性。
机译:纳米铜对火花等离子体烧结W-Cu复合材料致密化的影响
机译:高温固晶应用的Ag-Cu纳米膏烧结体的热学特性
机译:瞬态,大气压,小尺度等离子体的基础研究。