机译:实时接触电阻测量,以确定在超声波引线键合期间何时开始形成微焊缝
Department of Physics, University of Helsinki, P.O. Box 64, FI-00014 University of Helsinki, Finland,Finnish Meteorological Institute, P.O. Box 503, FI-00101 Helsinki, Finland,Angstrom Space Technology Centre, Department of Engineering Sciences, Uppsala University, P.O. Box 534, SE-75121 Uppsala, Sweden;
Department of Physics, University of Helsinki, P.O. Box 64, FI-00014 University of Helsinki, Finland;
Department of Physics, University of Helsinki, P.O. Box 64, FI-00014 University of Helsinki, Finland;
Department of Physics, University of Helsinki, P.O. Box 64, FI-00014 University of Helsinki, Finland,Helsinki Institute of Physics, University of Helsinki, P.O. Box 64, FI-00014 University of Helsinki, Finland;
ultrasound; wire bonding; contact resistance; real-time; microweld formation;
机译:薄膜热传感器,用于在超声波引线键合过程中实时测量接触温度
机译:电阻微焊中线板接头的初始接触电阻的计算
机译:电阻微挤出电阻线接头初始接触电阻的计算
机译:超声波铜丝焊接过程中微焊缝形成和断裂的分子动力学模拟
机译:超声波线性相控阵系统的开发,用于电阻点焊的实时质量监控。
机译:基于平行间隙电阻微挖的超滑动PTW8线与Au厚膜的连接方法
机译:分子动力学模拟超声波粘合过程中微型电线变化机制的研究