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Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation

机译：分子动力学模拟超声波粘合过程中微型电线变化机制的研究

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Yangyang Long; Bo He; Weizhe Cui; Yuhang Ji; Xiaoying Zhuang; Jens Twiefel;
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年度 2020
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Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation

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