Fabrication, assembly and testing of a glass interposer-based 3D systems in package

摘要

3D packaging is one of the most growing areas in the semiconductor industry that offers several possibilities of increasing a system miniaturization using the current integration nodes. Exploring the 3D dimension is a topic that was addressed years ago using vertical dies stacking and through substrate via technologies such as through silicon via (TSV) technology. This paper addresses the technology of the glass interposer-based 3D packaging which is a novel approach of chips assembly and still in progress and improvement in terms of dimensions, additional used materials and techniques of assembly. In our work, we first introduce this technology. Afterwards, we present our developed system both in the substrate level and the assembly level. The different processes are optimized in order to offer a low cost packaging solution. In progress with the fabrication steps, we will present several characterizations and a reliability testing in order to ensure that the developed test vehicles provide a measureable electrical connectivity and meet the minimal conditions of reliability. (C) 2016 Elsevier B.V. All rights reserved.