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机译:RIE动力学用于极端晶圆减薄应用
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium;
SPTS Technol, Ringland Way, Newport NP18 2TA, Shrops, England;
SPTS Technol, Ringland Way, Newport NP18 2TA, Shrops, England;
SPTS Technol, Ringland Way, Newport NP18 2TA, Shrops, England;
SPTS Technol, Ringland Way, Newport NP18 2TA, Shrops, England;
SPTS Technol, Ringland Way, Newport NP18 2TA, Shrops, England;
SPTS Technol, Ringland Way, Newport NP18 2TA, Shrops, England;
3D system on chip (3D SOC); Wafer to wafer (W2W) bonding; Wafer thinning; Reactive ion etching (RIE); End point detection (EPD); Through silicon vias (TSV) last;
机译:在线表征和键合晶圆的极端晶圆减薄的控制
机译:在线测量,用于表征和控制键合晶圆的极薄晶圆
机译:通过可变各向同性的深RIE工艺在晶圆通孔中制造射频应用
机译:硅晶片的极薄化,用于通孔和多晶片堆叠应用
机译:超薄硅晶片键合:物理和应用。
机译:用于微波和毫米波应用的超薄熔融石英晶片中通孔的制作
机译:应力诱导剥离法用于光伏应用的超薄硅晶晶圆的制备与表征
机译:选择性电化学晶圆减薄在硅表征中的应用。