A monolithic thermal inkjet printhead has been developed and demonstrated to operate successfully by combining monolithic growing of a nozzle plate on the silicon substrate and electrochemical etching of silicon for an ink feed hole. For the monolithic fabrication, a multiexposure and single development (MESD) technique and Ni electroplating are used to form cavities, orifices, and the nozzle plate. Electrochemical etching, as a back-end process, is applied to form an ink feed hole through the substrate, which is accurately aligned with the frontside pattern without any backside mask. The etch rate is nearly proportional to the current density up to 50 /spl mu/m/min. Experiments with a 50-/spl mu/m-diameter nozzle show ink ejection up to the operating frequency of 11 kHz with an average ink dot diameter of about 110 /spl mu/m for 0.3-A, 5-/spl mu/s current pulses.
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机译:通过结合在硅基底上的喷嘴板的单片生长和用于供墨孔的硅的电化学蚀刻相结合,已经开发出了单片热喷墨打印头,并证明了该单片热喷墨打印头可以成功运行。对于单片制造,使用多次曝光和单次显影(MESD)技术和Ni电镀来形成腔体,孔口和喷嘴板。进行电化学蚀刻,作为后端工艺,以形成穿过基板的供墨孔,该供墨孔与正面图案精确对齐,而没有任何背面掩模。蚀刻速率几乎与电流密度成正比,最高可达50 / spl mu / m / min。使用直径为50- / spl mu / m的喷嘴进行的实验显示,在0.3-A,5- / spl mu / s的情况下,最高11 kHz的工作频率下的墨水喷射量约为110 / spl mu / m的平均墨点直径。当前脉冲。
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