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FULLY INTEGRATED THERMAL INKJET PRINTHEAD HAVING MULTIPLE INK FEED HOLES PER NOZZLE

机译:完全集成的热喷墨打印头,每个喷嘴有多个供墨孔

摘要

Described herein is a monolithic printhead formed using integrated circuit techniques.Thin film layers (24, 40-50), including ink ejection elements (24, 62), are formed on a topsurface of a silicon substrate (20). The various layers are etched to provide conductive leads (25)to the ink ejection elements (24, 62). At least one ink feed hole (26, 66, 67) is formed throughthe thin film layers for each ink ejection chamber (30). In one embodiment, there are more inkfeed holes (26, 66, 67) than ink ejection chambers (30), so that more than one ink feed holeprovides ink to each ink ejection chamber. A trench (36) is etched in the bottom surface of thesubstrate (20) so that ink (38) can flow into the trench and into each ink ejection chamber (30)through the ink feed holes (26, 66, 67) formed in the thin film layers. An orifice layer (28) isformed on the top surface of the thin film layers to define the nozzles (34) and ink ejectionchambers (24, 62).
机译:本文描述了使用集成电路技术形成的整体式打印头。包括喷墨元件(24、62)的薄膜层(24、40-50)形成在顶部上硅衬底(20)的表面。蚀刻各层以提供导电引线(25)到喷墨元件(24、62)。至少一个供墨孔(26、66、67)穿过每个喷墨室(30)的薄膜层。在一实施例中,墨水更多供墨孔(26、66、67)比喷墨腔室(30)多,因此有多个供墨孔向每个喷墨腔提供墨水。沟槽(36)的底部表面被蚀刻。基板(20),以便墨水(38)可以流入沟槽并流入每个墨水喷射室(30)通过形成在薄膜层中的供墨孔(26、66、67)。孔口层(28)是形成在薄膜层的顶面上以限定喷嘴(34)和喷墨室(24,62)。

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