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Analysis of kink reduction and reliability issues in low-voltage DTD-based SOI TFET

机译:基于低压DTD的SOI TFET的扭结和可靠性问题分析

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This work proposes a silicon-on-insulator (SOI) tunnel field-effect transistor (TFET) with highly doped p++-type L-shaped trench, which creates two dual tunnel diodes (DTDs) and compares the results with conventional SOI (C-SOI) TFET structure. Kink effect is analysed in SOI TFET, and for eliminating kink effect, a method has been proposed. The tunnel current of the DTD eliminates the accumulation of holes and mitigates the kink effect. The impact of temperature variation on kink effect has been studied. In the case of C-SOI device, kink effect postpones with the rise in temperature and the DTD-SOI device provides improved performance even at high temperature with no kink in the current-voltage characteristics. Moreover, the reliability issues of DTD-SOI device have been examined by considering various noise components in the presence of interface traps.
机译:这项工作提出了一种绝缘体上的硅 - 隧道场效应晶体管(TFET),具有高掺杂的p ++ -Type L形沟槽,它产生两个双隧道二极管(DTD),并将结果与​​传统的SOI(C-SOI)TFET结构进行比较。在SOI TFET中分析了扭结效果,并且为了消除扭结效应,已经提出了一种方法。 DTD的隧道电流消除了孔的累积并减轻了扭结效果。研究了温度变化对扭结效应的影响。在C-SOI器件的情况下,扭结效应随着温度升高的推迟,即使在高温下,DTD-SOI器件也能够在电流 - 电压特性中没有扭结的高温提供改进的性能。此外,通过考虑在存在界面陷阱的存在下,通过考虑各种噪声分量来检查DTD-SOI设备的可靠性问题。

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