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High breakdown voltage AlGaN/GaN HEMTs with a dipole layer for microwave power applications

机译:具有偶极层的高击穿电压AlGaN / GaN HEMT,适用于微波功率应用

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摘要

A novel high breakdown voltage AlGaN/GaN high electron mobility transistor with a dipole layer (GaN DL-HEMT) is proposed in this work. The dipole layer (DL) is formed by AlGaN which is attached to the AlGaN barrier and located in the passivation layer between drain and gate electrodes. DL can improve significantly the breakdown voltage (BV) by modulating the distribution of electric field along the channel. The proposed GaN DL-HEMT exhibits a high BV of 1130 V, which increased from 496 V of conventional GaN HEMT with gate-drain distance of 5 m, while on-state resistance keeps 0.48 .mm and FOM at a high level of 2.67 GW/cm(2) is obtained. Meanwhile, the cutoff frequency maintains a large value as high as 32.4 GHz, which increases by 74% compared with GaN with a gate field plate. The novel GaN DL-HEMT shows great prospects in microwave power applications.
机译:在这项工作中提出了一种新型的具有偶极层的高击穿电压AlGaN / GaN高电子迁移率晶体管(GaN DL-HEMT)。偶极层(DL)由AlGaN形成,该AlGaN附着到AlGaN势垒并位于漏极和栅极之间的钝化层中。 DL可以通过调节沿通道的电场分布来显着改善击穿电压(BV)。所提出的GaN DL-HEMT具有1130 V的高BV,比常规GaN HEMT的496 V高,栅漏距离为5 m,而通态电阻保持0.48 mm,FOM保持在2.67 GW的高水平/ cm(2)已获得。同时,截止频率保持高达32.4 GHz的较大值,与带有栅场板的GaN相比,截止频率提高了74%。新型GaN DL-HEMT在微波功率应用中显示出广阔的前景。

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