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Vacuum-free fabrication of a low-voltage multi-bit memory device based on a ferroelectric polymer and photosensitive film

机译:基于铁电聚合物和感光膜的低压多位存储器件的无真空制造

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摘要

A multi-bit memory device was fabricated using a ferroelectric polymer. For multi-bit storage, a capacitive-type memory was configured to have two different thicknesses: a thinner sub-capacitor to represent the polarization reversal at a lower voltage and a thicker sub-capacitor that allows the two sub-capacitors to operate in different voltage ranges. The thin film was composed of a single ferroelectric polymer film and the thick film was composed of a hybrid film of a ferroelectric polymer and a photosensitive polymer. The photosensitive polymer reacted with ultraviolet light, so it was patterned by a conventional lithography process. The external voltage was divided into two layers, the ferroelectric layer and the photosensitive layer, which resulted in polarisation reversal at a higher voltage region. The most important feature of this work is that no vacuum equipment was used in the manufacturing process of the memory device. In the manufacturing process of the conventional multi-bit memory device, vacuum equipment was required to remove the polymer film. Therefore, the size of the substrate is limited and the productivity is inevitably lowered. The proposed multi-bit memory device and its fabrication process will be useful because it has many advantages in terms of productivity compared to existing processes.
机译:使用铁电聚合物制造多位存储器件。对于多位存储,电容型存储器配置为具有两种不同的厚度:较薄的子电容器表示较低电压下的极化反转,而较厚的子电容器允许两个子电容器在不同电压下工作电压范围。薄膜由单层铁电聚合物膜组成,厚膜由铁电聚合物和光敏聚合物的混合膜组成。光敏聚合物与紫外线反应,因此通过常规光刻工艺对其进行构图。外部电压分为铁电层和光敏层两层,这导致在较高电压区域的极化反转。这项工作的最重要特征是在存储设备的制造过程中没有使用真空设备。在常规的多位存储器件的制造过程中,需要真空设备以去除聚合物膜。因此,基板的尺寸受到限制并且生产率不可避免地降低。所提出的多位存储器件及其制造工艺将是有用的,因为与现有工艺相比,它在生产率方面具有许多优势。

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