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Big Grain and Flat Morphology-A New Tin Electrolyte for Minimal Whiskering and Excellent Solderability

机译:大晶粒和扁平形貌-一种新型锡电解液,可减少晶须的产生并具有出色的可焊性

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摘要

StannoPure ? HSM ST has been developed to provide large grain size and minimal surface roughness to satisfy the iNEMI Tin User Group's failure to recommend the use of bright tin for the majority of technical applications following the reclassification between bright and matte tin plating solutions with regard to carbon incorporation and grain size.
机译:StannoPure?已开发出HSM ST,以提供较大的晶粒尺寸和最小的表面粗糙度,从而满足iNEMI锡用户组在将亮光和哑光镀锡解决方案之间就碳结合量进行重新分类之后,未能建议将亮光锡用于大多数技术应用和晶粒尺寸。

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