机译:在极低膨胀率的玻璃陶瓷晶片上进行化学机械抛光
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China,Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Chemical mechanical polishing; Glass ceramics; Surface roughness; Extremely low expansion; Polishing pad;
机译:先进陶瓷(氮化硅)和玻璃(二氧化硅)的磁浮法抛光(MFP)中的化学机械抛光(CMP)
机译:硅晶片抛光效果的提高助长巨型型振动辅助化学机械抛光
机译:分析不同抛光垫轮廓的化学机械平坦化抛光晶片的有效抛光频率和次数的方法
机译:极低膨胀玻璃陶瓷晶片上的化学机械抛光
机译:光从化学机械抛光的晶片上的缺陷散射。
机译:超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
机译:抛光参数对LiTaO3晶圆化学机械抛光过程的影响