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首页> 外文期刊>Materials science forum >Mechanisms of Nitrogen incorporation at 4H-SiC/SiO_2 interface during Nitric Oxide passivation - A first principles study
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Mechanisms of Nitrogen incorporation at 4H-SiC/SiO_2 interface during Nitric Oxide passivation - A first principles study

机译:一氧化氮钝化过程中4H-SiC / SiO_2界面氮掺入的机理

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摘要

In this work, we investigate the behavior of Nitrogen atoms at 4H-Silicon Carbide (4H-SiC)/Silicon dioxide (SiO_2) interface during nitric oxide passivation using ab-initio Density Functional Theory. Our calculations suggest different possible energetically favorable and competing mechanisms by which nitrogen atoms could a) incorporate themselves into the oxide, just above the 4H-SiC substrate, and b) substitute for carbon atoms at the 4H-SiC surface. We attribute the former process to cause increased threshold voltage instability (hole traps), and the latter to result in improved effective mobility through channel counter-doping, apart from removing interface traps in 4H-SiC power MOSFETs. These results support recent electrical and XPS measurements. Additionally, Nitric Oxide passivation is shown to energetically favor re-oxidation of the 4H-SiC surface accompanied by the generation of oxygen vacancies under the conditions considered in this work.
机译:在这项工作中,我们使用从头算密度函数理论研究一氧化氮钝化过程中4H-碳化硅(4H-SiC)/二氧化硅(SiO_2)界面上氮原子的行为。我们的计算结果提出了不同的可能的能量上有利和竞争的机制,氮原子可通过这些机制将自身掺入4H-SiC衬底上方的氧化物中,以及b)替代4H-SiC表面的碳原子。我们将前一种工艺归因于引起阈值电压不稳定性(空穴陷阱)的增加,而后一种工艺除了去除4H-SiC功率MOSFET中的界面陷阱以外,还通过沟道反向掺杂提高了有效迁移率。这些结果支持最近的电气和XPS测量。此外,一氧化氮钝化被证明在本研究中考虑的条件下,在能量上有利于4H-SiC表面的再氧化,并伴随着氧空位的产生。

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