机译:Ti-Zr-Cu基填充合金在过渡液相键合Ti_2AINb合金过程中键合温度对组织发展的影响
National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology,Nanchang Hangkong University, Nanchang 330063, China;
National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology,Nanchang Hangkong University, Nanchang 330063, China;
Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology,Hangzhou 310014, China;
National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology,Nanchang Hangkong University, Nanchang 330063, China;
National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology,Nanchang Hangkong University, Nanchang 330063, China;
Ti_2AINb; TLP bonding; Isothermally solidification;
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