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Interface engineering of gate dielectrics with multifunctional self-assembled monolayers in copper phthalocyanine based organic field-effect transistors

机译:基于铜酞菁的有机场效应晶体管多功能自组装单层的栅极电介质接口工程

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To enhance the performance of organic field-effect transistors (OFETs) not only properties of gate oxide, active organic layer and source and drain needs to be improved but it is essential to engineer the different interfaces in OFETs. In this aspect, the gate oxide/organic semiconductor and electrode/organic semiconductor interfaces are engineered by various functional groups to obtain high performance OFETs. CuPc-based FETs were fabricated by surface treatment with various self-assembled monolayers (SAMs); octadecyltrichlorosilane(OTS), hexame-thyldisilazane (HMDS) and pentaflurothiophenol (PFBT), at an interface between gate oxide or gate dielectric layer and active organic layer. The influence of SAMs on the device performance was examined in the present study. Low-voltage operating CuPc-based OFETs with high field effect mobility were fabricated in current work. Significant development in the device parameters, especially the field effect mobility was observed for HMDS treated CuPc-FET as compared to the OTS and PFBT treated CuPc-FET. The OFETs with the SAM-treatments exhibit the field effect mobility was 5.6 × 10~(-2)cm~2 V~(-1) s~(-1) (OTS) to 1.369 cm~2 V~(-1) s~(-1) (PFBT-treated) and 1.537 cm~2 V~(-1)s~(-1) (HMDS-treated).The improved performance of the OFET were related to the improve crys-tallinity with larger grain size of the organic semiconductor with reduced trap densities and improved contact resistance between the metal electrode and organic semiconductor due to the introduction of monolayer at the interface.
机译:为了增强有机场效应晶体管(OFET)的性能,不仅需要提高栅极氧化物,有源有机层和源极和漏极的性能,但对OFETS中的不同界面工程是必要的。在这方面,通过各种官能团设计栅极氧化物/有机半导体和电极/有机半导体界面,以获得高性能的et et。采用各种自组装单层(SAMS)的表面处理制造基于CUPC的FET;八氯丙基三氯硅烷(OTS),Hexame-甲基二硅氮烷(HMDS)和五氟噻吩(PFBT),在栅极氧化物或栅极介电层和有源有机层之间的界面处。在本研究中研究了SAMS对装置性能的影响。基于低压操作CUPC的QUEET,在当前的工作中制造了高场效果移动性。与OTS和PFBT处理的Cupc-FET相比,在设备参数中,尤其观察到HMDS处理的Cupc-FET的显着发展。具有SAM处理的OFETS表现出现场效果迁移率为5.6×10〜(-2)cm〜2 V〜(-1)S〜(-1)(OTS)至1.369 cm〜2 V〜(-1) S〜(-1)(PFBT处理)和1.537厘米〜2 V〜(-1)S〜(-1)(HMDS处理)。欧洲全部的改善性能与改善的Crys-Talbinity有关有机半导体的晶粒尺寸,具有降低的陷阱密度,并且由于在界面处引入单层而改善了金属电极和有机半导体之间的接触电阻。

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