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Fabrication of GaN-based nanorod light emitting diodes using self-assemble nickel nano-mask and inductively coupled plasma reactive ion etching

机译:使用自组装镍纳米掩模和电感耦合等离子体反应离子刻蚀制备GaN基纳米棒发光二极管

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摘要

We report a novel method to fabricate GaN-based nanorod light emitting diodes (LEDs) with controllable dimension and density using self-assemble nickel (Ni) and Ni/Si_3N_4 nano-masks and inductively coupled plasma reactive ion etching (ICP-RIE). Under the fixed Cl_2/Ar flow rate of 50/20 sccm, ICP/Bias power of 400/100 W and chamber pressure of 0.67 Pa, the GaN-based nanorod LEDs were fabricated with density of 2.2 x 10~9 to 3 x 10~(10)cm~(-2) and dimension of 150-60 nm by self assemble Ni nano-masks with various size. The size of Ni/Si_3N_4 nano-mask was control by the thickness Ni film ranging 150-50 A and rapid thermal annealing condition. The technique offers a controllable method of fabrication of GaN-based nanorod LEDs and should be applicable for fabrication of the others Ⅲ-Ⅴ nanoscale photonic and electronic devices.
机译:我们报告了一种新颖的方法,可使用自组装镍(Ni)和Ni / Si_3N_4纳米掩模和感应耦合等离子体反应离子刻蚀(ICP-RIE)来制造尺寸和密度可控制的GaN基纳米棒发光二极管(LED)。在固定的Cl_2 / Ar流量为50/20 sccm,ICP /偏置功率为400/100 W,腔室压力为0.67 Pa的情况下,制造了密度为2.2 x 10〜9至3 x 10的GaN基纳米棒LED。通过自组装各种尺寸的Ni纳米掩模,可达到〜(10)cm〜(-2)和150-60 nm的尺寸。 Ni / Si_3N_4纳米掩模的尺寸由厚度范围为150-50 A的Ni膜和快速热退火条件控制。该技术提供了一种可控制的制造基于GaN的纳米棒LED的方法,并且应适用于其他Ⅲ-Ⅴ纳米级光子和电子器件的制造。

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