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机译:后回流过程中的热退火对Sn-Ag-Cu焊点的组织,锡晶体学和冲击可靠性的影响
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan;
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan;
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan;
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan;
Lead-free solder; Impact reliability; Electronic materials; Hardness; Microstructure;
机译:等温时效对具有不同Sn-Ag-Cu焊点的细间距球栅阵列封装的长期可靠性的影响
机译:微量合金元素对低银Sn-Ag-Cu焊点热循环和跌落冲击可靠性的影响
机译:热循环对Sn-Ag-Cu焊点和板级跌落可靠性的影响
机译:热循环高可靠性Sn-Ag-Cu焊点在SN-Ag-Cu焊点中的微合金化作用
机译:锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响,包括混合焊点在等温老化下的微观结构变化
机译:随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
机译:环境试验下表面安装过程中SN-ZN焊点的热疲劳可靠性和机械疲劳可靠性