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机译:不同瞬态液相焊接温度下Ni / Sn / Cu体系中形成的金属间化合物的晶粒形貌演变和机械强度变化
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China;
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China;
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China,State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China,State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China;
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China;
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China,State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
Transient liquid phase soldering; Intermetallic joints; Grain morphology; Shear strength;
机译:采用瞬态液相焊接工艺在不对称Ni / Sn / Cu / Cu / Cu / Cu / Cu系统中形成的高熔温金属间接头的晶粒形态和机械强度
机译:使用超声诱导的瞬态液相焊接工艺在不对称Ni / Sn / Cu / Cu / Cu系统中快速形成的均相(Cu,Ni)(6)Sn-5金属间化合物接头
机译:在极端温度环境下SN-3AG-0.5CU / Ni焊点中的Ni-Cu-SN金属间化合物的相变脆性脆性诱导
机译:用瞬态液相焊接形成Cu-Sn-Ni金属间金属间金属间金属间金属间隙的机械性能
机译:液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
机译:金属间化合物在控制Cu- Sn-Ag-Cu-Bi-Bi -Cu钎焊接头的微结构物理和力学性能中的作用
机译:Cu-snO和Cu3sn金属间化合物初始形貌和厚度对sn-ag焊料/ Cu接头热老化过程中生长和演变的影响