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Mechanisms of ZnO buffer layer in bottom gate ZnO:Al transparent thin film transistors

机译:底栅ZnO:Al透明薄膜晶体管中ZnO缓冲层的机理

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The structure of Al-doped ZnO (ZnO:Al) transparent thin-film transistors (TTFTs) were deposited at room temperature using a radio frequency magnetron cosputter system. The performances of the ZnO:Al TTFTs were improved by inserting a ZnO buffer layer between the ZnO:Al channel layer and the SiO_2 gate insulator. The ZnO:Al TTFTs with 80-nm-thick ZnO buffer layer exhibited a higher field-effect mobility of 90.1 cm~2 (V s)~(-1) a lower subthreshold slope of 0.24 V/decade and a lower maximum surface state density of 2.69 × 10~(11) eV~(-1) cm~2. The associated on-to-off current ratio of the TTFTs was 1.2 × 10~8. The performance improvement of the ZnO:Al TTFTs was attributed to crystalline improvement and the releasing functions of lattice mismatching and strain between the ZnO:Al channel layer and the SiO_2 insulator layer.
机译:使用射频磁控共溅射系统在室温下沉积Al掺杂的ZnO(ZnO:Al)透明薄膜晶体管(TTFT)的结构。通过在ZnO:Al沟道层和SiO_2栅极绝缘体之间插入ZnO缓冲层,可以改善ZnO:Al TTFT的性能。具有80nm厚ZnO缓冲层的ZnO:Al TTFT表现出更高的场效应迁移率90.1 cm〜2(V s)〜(-1),更低的亚阈值斜率0.24 V /十倍和更低的最大表面态密度为2.69×10〜(11)eV〜(-1)cm〜2。 TTFT的相关通断电流比为1.2×10〜8。 ZnO:Al TTFTs的性能改善归因于结晶度的改善以及ZnO:Al沟道层和SiO_2绝缘层之间晶格失配和应变的释放功能。

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