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Method of manufacturing P-type ZnO semiconductor layer using atomic layer deposition and thin film transistor including the P-type ZnO semiconductor layer

机译:使用原子层沉积和包括该P型ZnO半导体层的薄膜晶体管制造P型ZnO半导体层的方法

摘要

Provided are a method of manufacturing a transparent N-doped p-type ZnO semiconductor layer using a surface chemical reaction between precursors containing elements constituting thin layers, and a thin film transistor (TFT) including the p-type ZnO semiconductor layer. The method includes the steps of: preparing a substrate and loading the substrate into a chamber; injecting a Zn precursor and an oxygen precursor into the chamber, and causing a surface chemical reaction between the Zn precursor and the oxygen precursor using an atomic layer deposition (ALD) technique to form a ZnO thin layer on the substrate; and injecting a Zn precursor and an nitrogen precursor into the chamber, and causing a surface chemical reaction between the Zn precursor and the nitrogen precursor to form a doping layer on the ZnO thin layer.
机译:提供一种利用包含构成薄层的元素的前驱体与包括该p型ZnO半导体层的薄膜晶体管(TFT)之间的表面化学反应来制造透明的N掺杂的p型ZnO半导体层的方法。该方法包括以下步骤:准备衬底并将该衬底装载到腔室中;以及将Zn前驱物和氧前驱物注入腔室内,并利用原子层沉积(ALD)技术引起Zn前驱物和氧前驱物之间的表面化学反应,以在基板上形成ZnO薄层。向腔室中注入Zn前驱物和氮前驱物,并引起Zn前驱物和氮前驱物之间的表面化学反应,以在ZnO薄层上形成掺杂层。

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