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机译:石墨烯纳米片增强Sn58Bi无铅焊料的组织和性能
Tianjin Univ, Tianjin Key Lab Low Dimens Mat Phys & Preparing T, Inst Adv Mat Phys, Fac Sci,Dept Appl Phys, Tianjin 300072, Peoples R China;
Tianjin Univ, Tianjin Key Lab Low Dimens Mat Phys & Preparing T, Inst Adv Mat Phys, Fac Sci,Dept Appl Phys, Tianjin 300072, Peoples R China;
Tianjin Univ, Tianjin Key Lab Low Dimens Mat Phys & Preparing T, Inst Adv Mat Phys, Fac Sci,Dept Appl Phys, Tianjin 300072, Peoples R China;
Tianjin Univ, Tianjin Key Lab Low Dimens Mat Phys & Preparing T, Inst Adv Mat Phys, Fac Sci,Dept Appl Phys, Tianjin 300072, Peoples R China;
Tianjin Univ, Tianjin Key Lab Low Dimens Mat Phys & Preparing T, Inst Adv Mat Phys, Fac Sci,Dept Appl Phys, Tianjin 300072, Peoples R China;
Graphene nanosheets; Lead-free solder; Microstructure; Mechanical properties; Creep performance;
机译:Cu / SN58BI / Cu焊点轴承轴承石墨烯纳米片3D包装的微观结构演变
机译:镀镍石墨烯纳米片增强的新型Sn-Ag-Cu无铅焊料的组织和性能
机译:石墨烯纳米片增强对Sn-Ag-Cu无铅焊料性能的影响
机译:Er对Sn58bi基无铅焊料组织和力学性能的影响
机译:机械表征和衰老诱导的无铅焊料材料的循环性能和微观结构演变
机译:热解法制备Cu包覆石墨烯纳米片增强Sn2.5Ag0.7Cu0.1RE复合钎料的组织与性能
机译:镀镍石墨烯纳米片增强的新型Sn-Ag-Cu无铅焊料的组织和性能