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首页> 外文期刊>IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing >Automated removal and replacement of through-hole components in robotic rework
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Automated removal and replacement of through-hole components in robotic rework

机译:自动化返工中的通孔组件的自动拆卸和更换

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摘要

The need for computer controlled, fully automated rework stations has increased recently due to potential difficulties involved in manual rework of printed circuit board assemblies (PCBAs). An autonomous fully-automated robotic rework cell has been developed for the rework of TH and SM components. This paper concentrates on TH component removal and replacement issues. After a brief introduction to TH rework technology and overall cell structure, it draws attention to the main issues of component removal with regard to gripping and heating. Two multifunctional grippers that are unique in their design are presented as a solution for clinched TH component removals. Since heat is the major issue in the process, dwell times for component removal and replacement are given based on a full scale experimental study. Results of automated TH rework evaluations include the success of leg cutting, spray fluxing, removal and replacement of components.
机译:由于印刷电路板组件(PCBA)的人工返修涉及潜在的困难,最近对计算机控制的全自动返修站的需求有所增加。已经开发了自治的全自动机器人返修单元,用于TH和SM组件的返修。本文着重于TH组件的拆卸和更换问题。在简要介绍TH返工技术和整体电池结构之后,它提请注意与夹持和加热有关的组件移除的主要问题。展示了两种设计独特的多功能抓手,作为解决TH部件拆卸问题的解决方案。由于热量是该过程中的主要问题,因此根据全面的实验研究给出了组件移除和更换的停留时间。自动化TH返工评估的结果包括割脚,喷雾助焊剂,去除和更换组件的成功。

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