As an easy-to-maintain low-cost packaging system, a sub-board packaging configuration has been developed. However, the simultaneous switching noise tends to increase, because a large number of switching large scale integrations (LSIs) are integrated in a sub-board. A low-cost technique for reducing simultaneous switching noise in sub-boards has been developed. A thin insulator film made of conventional FR4 substrate material is used to reduce the frequency response in the power-supply planes of the sub-board at frequencies below about 600 MHz. The V/sub u/ peak-noise amplitude was reduced by about 50% when 32 switching gates in the sub-board were simultaneously driven at 622.08 Mb/s.
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机译：作为易于维护的低成本包装系统，已经开发了副板包装配置。但是，由于在子板上集成了大量的开关大规模集成（LSI），因此同时开关噪声趋于增加。已经开发出一种用于降低子板上的同时开关噪声的低成本技术。使用由常规FR4基板材料制成的绝缘子薄膜来降低子板电源平面中低于600 MHz的频率响应。当以622.08 Mb / s同时驱动子板上的32个开关门时，V / sub u /峰值噪声幅度降低了约50％。
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