首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Impact of arsenic species (As_2/As_4) on the relaxation and morphology of step-graded InAs_xP_(1-x) on InP substrates
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Impact of arsenic species (As_2/As_4) on the relaxation and morphology of step-graded InAs_xP_(1-x) on InP substrates

机译:砷物种(As_2 / As_4)对InP衬底上阶梯式InAs_xP_(1-x)弛豫和形态的影响

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摘要

The influence of arsenic species (As_2 or As_4) on compositionally graded InAs_xP_(1-x) buffer layers (x=0.15 -0.8) grown by molecular beam epitaxy on InP is investigated. It was found that As_2 has a higher incorporation rate than As_4. Anisotropic strain relaxation occurs for samples grown with As_4, with higher relaxation along [110] and lower relaxation along [1—10]. Relatively high and isotropic strain relaxation occurs for buffers grown with As_2. The observed mosaic broadening is much greater when using As_2. Atomic force microscopy morphological features are consistent with the strain relaxation results. Strong corrugations along [1-10] dominate the surface of films grown with As_4, while grainy surfaces occur with As_2. The use of As_4 increased the overall surface roughness. The authors interpret these results with a simple model: the higher incorporation rate of As_2 enables In to incorporate more uniformly in the two perpendicular < 110 > directions, while the lower incorporation rate of As_4 decreases this uniformity. The different incorporation rates of In in the [110] and [1-10] directions may result in diverse morphologies and strain relaxation induced by arsenic spices.
机译:研究了砷分子(As_2或As_4)对分子束外延生长在InP上的组成渐变的InAs_xP_(1-x)缓冲层(x = 0.15 -0.8)的影响。发现As_2具有比As_4更高的结合率。随As_4生长的样品会发生各向异性应变松弛,沿[110]的应变较高,而沿[1-10]的应变较低。用As_2生长的缓冲液会发生较高的各向同性应变松弛。使用As_2时,观察到的镶嵌变宽更大。原子力显微镜的形态特征与应变松弛结果一致。沿[1-10]的强波纹主导了用As_4生长的薄膜表面,而用As_2则出现了颗粒状表面。 As_4的使用增加了整体表面粗糙度。作者用一个简单的模型解释了这些结果:较高的As_2掺入率使In在两个垂直的<110>方向上更均匀地掺入,而较低的As_4掺入率降低了这种均匀性。 In在[110]和[1-10]方向上的不同掺入率可能会导致砷香料引起不同的形貌和应变松弛。

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