Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxane

摘要

In this work, chemical-mechanical polishing (CMP) of the organic polymer, methylsilsesquioxane (MSQ), has been investigated. For conventional silicate-based slurry, the CMP removal rate o MSQ is low and many scratches are formed at the surface. Moreover, the dielectric properties of a post-CMP MSQ film are degraded in comparison to the as-cured MSQ. We have proposed a reliable process for the CMP of MSQ which includes a slurry of additive and a post-CMP NH_3 plasma treatment.