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首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Strain relaxation and surface roughness of In_xAl_(1-x)As graded buffer layers grown on InP for 6.05 A applications
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Strain relaxation and surface roughness of In_xAl_(1-x)As graded buffer layers grown on InP for 6.05 A applications

机译:In_xAl_(1-x)As在6.05 A的InP上生长的渐变缓冲层的应变弛豫和表面粗糙度

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摘要

In this study, metamorphic compositionally graded In_xAl_(1-x)As layers grown on InP by molecular beam epitaxy with a final indium mole fraction of x=1.0 (6.05 A) are investigated. To examine the effects of relative growth temperature on strain relaxation and surface morphology at different stages of the buffer layer growth, a series of samples was produced with the indium mole fraction graded from x=0.52 to x=0.64, 0.79, and 1.0 with a constant grading rate. The high misfit dislocation velocity in this system allows the grading to be accomplished with a thin layer (~1μm), complete strain relaxation and low threading dislocation densities. The evolution of the strain relaxation, threading dislocation density, and surface morphology were evaluated by triple axis x-ray diffraction, transmission electron microscopy (TEM), etch pit density (EPD), and atomic force microscopy. Higher growth temperature led to threading densities as low as 10~6 cm~(-2), as measured by plan-view TEM and EPD. The final surface roughness was controlled by the growth temperature of a constant composition cap layer.
机译:在这项研究中,研究了通过分子束外延在InP上生长的变质成分渐变In_xAl_(1-x)As层,最终铟摩尔分数为x = 1.0(6.05 A)。为了检查相对生长温度对缓冲层生长不同阶段的应变松弛和表面形态的影响,生产了一系列样品,铟摩尔分数从x = 0.52到x = 0.64、0.79和1.0,等级为分级率恒定。该系统中的高失配位错速度使得可以通过薄层(〜1μm),完全的应变松弛和低的螺纹位错密度来完成分级。通过三轴X射线衍射,透射电子显微镜(TEM),蚀刻坑密度(EPD)和原子力显微镜对应变松弛,螺纹位错密度和表面形态的演变进行了评估。通过平面TEM和EPD测量,较高的生长温度导致穿线密度低至10〜6 cm〜(-2)。最终表面粗糙度由恒定组成的覆盖层的生长温度控制。

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