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Microstructural and electrical resistance analysis of laser-processed SiC substrates for wide bandgap semiconductor materials

机译:宽带隙半导体材料的激光加工SiC衬底的微结构和电阻分析

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摘要

Highly conductive phases have been generated on different polytypes of SiC substrates using a laser direct-write technique. Incorporation of both n-type and p-type impurities into the SiC substrates was accomplished by laser irradiation in dopant-containing ambients. X-ray diffraction, energy dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy have been used to detect the presence of the dopant atoms and the compositional variation induced by laser irradiation. Scanning electron microscopy was used to study the microstructure, morphology and dimensions of the converted regions. The conversion in electric resistance has been attributed to both structural and compositional variations observed for the irradiated tracks
机译:使用激光直接写入技术已在不同类型的SiC衬底上生成了高导电相。通过在含掺杂剂的环境中进行激光照射,可以将n型和p型杂质同时掺入SiC衬底中。 X射线衍射,能量色散X射线光谱和X射线光电子光谱已用于检测掺杂原子的存在以及由激光辐照引起的组成变化。扫描电子显微镜用于研究转化区域的微观结构,形态和尺寸。电阻的转换归因于对照射道的观察到的结构和成分变化

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  • 来源
    《Journal of Materials Science》 |2005年第15期|3969-3981|共13页
  • 作者单位

    Intel Corporation -Assembly Technology Development;

    Applicote Associates;

    Laser-Aided Manufacturing Materials and Micro-Processing Laboratory (LAMMMP) School of Optics Center for Research and Education in Optics and Lasers (CREOL) University of Central Florida;

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