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Understanding Electrically Active Interface Formation on Wide Bandgap Semiconductors through Molecular Beam Epitaxy Using Fe3O 4 for Spintronics as a Base Case

机译:通过分子束外延,使用Fe3O 4作为自旋电子学,通过分子束外延了解宽带隙半导体上的电活性界面形成

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摘要

Nanoelectronics, complex heterostructures, and engineered 3D matrix materials are quickly advancing from research possibilities to manufacturing challenges for applications ranging from high-power devices to solar cells to any number of novel multifunctional sensors and controllers. Formation of an abrupt and effective interface is one of the basic requirements for integration of functional materials on different types of semiconductors (from silicon to the wide bandgaps) which can significantly impact the functionality of nanoscale electronic devices. To realize the potential of next-generation electronics, the understanding and control of those initial stages of film layer formation must be understood and translated to a process that can control the initial stages of film deposition.;Thin film Fe3O4 has attracted much attention as a material for exploring the potential of spintronics in next-generation information technologies. Synthesis of highly spin-polarized material as spin sources, in combination with wide bandgap semiconductors which have a long spin relaxation time in addition to functionality in high-temperature, high-power, and high-frequency environments, would enhance the performance of today's spintronic devices. Spinel ferrite Fe3O4 has a high Curie temperature of 858 K and it is predicted to possess half-metallic properties, i.e. ~ 100% spin polarization at the Fermi level, which can lead to ultrahigh tunneling magnetoresistance at room temperature. However, these properties have been very difficult to realize in thin film form, and device design strategies require high-quality thin films of Fe3O4. The most common reason reported in literature for the failure of the films to achieve theoretical performance is that the growth techniques used today produce films with antiphase boundaries (APB). These APBs have a strong antiferromagnetic coupling that negatively impact the magnetic and transport properties of epitaxial Fe 3O4 films.;Therefore, greater understanding of how to reduce APB density is of essential importance for applications of Fe3O4 films, and understanding the complex chemical and structural influences on the initial stages of film deposition is the key to eliminating APB density. This work used molecular beam epitaxy (MBE) to further understand the nucleation and growth mechanism needed to ensure single crystal film formation in a controlled orientation directly on a semiconductor (SiC) and then also on an insulating layer (MgO) that can not only align crystal structure but also provide an effective spin-aligned tunnel junction material.;The starting substrate surface proved critical to effective integration, and the role of atomic hydrogen seems to be key in controlling the starting surface. We have investigated 1) the hydrogen furnace cleaning at 1600 °C of 6H-SiC (0001) substrates surfaces to produce a smooth, uniformly stepped surface and a √3x√3 R30° surface reconstruction with less than 10 at% residual oxygen contamination, 2) the atomic hydrogen cleaning of 6H-SiC (0001) substrates to produce a (1x1) surface structure with less than 7 at% residual oxygen contamination at relatively low temperature of 700 °C, 3) the atomic hydrogen cleaning of Ge (100) to produce smooth surface (RMS < 0.5 nm over a 1 mum2 area), and 4) the oxygen plasma cleaning of MgO (111) substrates. Each of these starting surfaces, in addition to single crystalline MgO (111) films deposited on SiC (0001) by MBE, produced different initial growth mechanisms for MgO and Fe3 O4.;The highest quality single crystalline, epitaxial Fe 3O4 (111) films were deposited by MBE on the √3x√3 R30 surface reconstruction with less than 10 at% residual oxygen contamination 6H-SiC. The Fe3O4 film exhibits high structural order with sharp interfaces and an easy axis in-plane magnetization with a coercivity of 200 Oe. The MgO deposited by MBE on SiC prepared by the hydrogen furnace was found to have two-dimensional features that transitioned from 2D to 3D when the thickness exceeded 2nm; the structure changed from hexagonal to rock-salt due to relaxation as the layer thickness increased. MgO deposited by MBE on atomic hydrogen cleaned SiC had the rock-salt structure from the beginning due to the more thermodynamically stable arrangement on the non-reconstructed starting surface. This is one example of how we have shown the ability to balance kinetic and thermodynamic drivers through the use of starting surface chemistry and structure and processing techniques. This understanding enables the development of processing strategies to reduce APBs in Fe3O 4 on SiC and ultimately lead to the next generation of spintronic devices.
机译:纳米电子学,复杂的异质结构和工程化的3D矩阵材料正迅速从研究可能性向制造挑战发展,其应用范围从大功率设备到太阳能电池,再到任何数量的新型多功能传感器和控制器。突然而有效的界面的形成是功能材料在不同类型的半导体(从硅到宽带隙)上集成的基本要求之一,这会严重影响纳米级电子设备的功能。为了实现下一代电子技术的潜力,必须理解和控制对薄膜层形成的初始阶段,并将其转化为可以控制薄膜沉积初始阶段的过程。薄膜Fe3O4作为一种新型材料已引起了广泛的关注。探索自旋电子学在下一代信息技术中的潜力的材料。合成高度自旋极化的材料作为自旋源,再加上宽禁带半导体,除了在高温,高功率和高频环境下的功能外,该半导体具有长的自旋弛豫时间,将增强当今的自旋电子学性能设备。尖晶石型铁氧体Fe3O4的居里温度高达858 K,据预测具有半金属性能,即费米能级约100%的自旋极化,可导致室温下超高隧穿磁阻。然而,以薄膜形式很难实现这些特性,并且器件设计策略需要高质量的Fe3O4薄膜。文献中报道的薄膜无法达到理论性能的最常见原因是当今使用的生长技术生产出具有反相边界(APB)的薄膜。这些APB具有很强的反铁磁耦合能力,会对外延Fe 3O4薄膜的磁性和传输性能产生负面影响。在薄膜沉积的初期阶段,消除APB密度至关重要。这项工作使用分子束外延(MBE)来进一步了解成核和生长机制,以确保在受控方向上直接在半导体(SiC)上形成单晶膜,然后在不仅能对准的绝缘层(MgO)上成膜晶体结构,但也提供了一种有效的自旋对准隧道结材料。起始衬底表面被证明对有效集成至关重要,并且氢原子的作用似乎是控制起始表面的关键。我们研究了以下内容:1)在1600°C的氢气炉中清洗6H-SiC(0001)基板表面,以产生光滑,台阶状的表面和√3x√3R30°的表面重构,残留氧污染少于10 at%, 2)原子氢清洗6H-SiC(0001)基板以产生(1x1)表面结构,且在700°C的相对较低温度下残留氧污染小于7 at%,3)锗(100)的原子氢清洗)以产生光滑的表面(在1 m2的面积上RMS <0.5 nm),以及4)氧等离子体清洁MgO(111)基板。除了通过MBE在SiC(0001)上沉积的单晶MgO(111)膜外,这些起始表面中的每一个都对MgO和Fe3 O4产生了不同的初始生长机制;最高质量的单晶外延Fe 3O4(111)膜由MBE沉积在√3x√3R30表面重建上,残留氧污染6H-SiC小于10 at%。 Fe3O4薄膜具有高结构序,具有清晰的界面和易于矫正的200 Oe轴轴向平面内磁化强度。通过MBE在氢炉制备的SiC上沉积的MgO被发现具有二维特征,当厚度超过2nm时,该二维特征从2D转变为3D。随着层厚的增加,由于弛豫,结构从六角形变为盐岩。 MBE在氢原子净化的SiC上沉积的MgO从一开始就具有岩盐结构,这是因为在未重建的起始表面上具有更热力学稳定的布置。这是一个例子,说明了我们如何通过使用起始表面化学以及结构和加工技术来平衡动力学和热力学驱动因素。这种理解可以开发出减少SiC上Fe3O 4中的APB的处理策略,并最终导致下一代自旋电子器件。

著录项

  • 作者

    Hamedani Golshan, Negar.;

  • 作者单位

    Northeastern University.;

  • 授予单位 Northeastern University.;
  • 学科 Chemical engineering.;Materials science.
  • 学位 Ph.D.
  • 年度 2017
  • 页码 128 p.
  • 总页数 128
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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