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机译:铜芯焊点的断裂行为
School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul, 136-702, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul, 136-702, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul, 136-702, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul, 136-702, Republic of Korea;
MK Electron Co., Ltd, 316-2 Geumeoh-ri, Pogok-eup, Cheoin-gu, Yongin-si, Kyeonggi-do, 449-812, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul, 136-702, Republic of Korea;
机译:铜芯焊点的断裂行为
机译:含铜芯焊球的球栅阵列焊点的界面反应和力学性能
机译:Janus面对Cu-Co-Co-Co58Bi焊点的电流强调下的janus面对Cu核外周形成和BI相再分配
机译:BGA封装中CU焊接点的断裂寿命评估
机译:电子应用的无铅焊点断裂:材料,加工和装载条件的影响
机译:使用Sn纳米粒子增强焊膏焊接无源部件:对微观结构和关节强度的影响
机译:Ni-P浴对Sn-Ag-Cu焊料/ Enepig焊点脆性骨折的影响