机译:纳米线增强Ag纳米颗粒糊剂的低温无压粘合
Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
Department of Chemical Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
机译:纳米线增强Ag纳米颗粒糊剂的低温无压粘合
机译:室温下与银纳米线膏的无压粘合:用于有机电子和热敏功能器件的包装
机译:纳米银浆无压烧结以粘结大面积电子封装用大功率(每千日元零件100 mm(2))功率芯片的参数研究
机译:通过使用新型铜纳米粒子糊料的低温无压烧结,为高功率器件提供高度可靠的芯片键合方法
机译:采用金-硅共晶结合和局部加热的低温晶圆级真空包装
机译:高度可烧结的铜纳米颗粒糊剂的低温低压铜-铜键合
机译:AG纳米线和纳米层组复合膏用于低温粘合