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Dielectric and thermal properties of GFs/PTFE composites with hybrid fillers of Al_2O_3 and hBN for microwave substrate applications

机译:GFS / PTFE复合材料的介电和热性能,具有用于微波衬底应用的AL_2O_3和HBN的杂交填料

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摘要

The alumina/hexagonal boron nitride/glass fibers cloth/Polytetrafluo-roethylene (Al_2O_3-hBN/GFs/PTFE) composites were prepared by blending-impregnation followed by hot compression method, and the dielectric, thermal properties of the composites with various hBN fillers content (0-20 wt.%) were investigated. The results show that the thermal conductivity of the composites increase significantly, while the coefficient of thermal expansion (CTE) decrease gradually, with the hBN content increasing. Composite substrates with 20 wt.% hBN exhibited high thermal conductivity as 1.05 W m~(-1) K~(-1), which is 5.3 times that of pure PTFE. Such compositions may be a promising material in high thermal conductivity copper clad laminate.
机译:通过混合浸渍,用热压缩方法和具有各种HBN填充物含量的复合材料的电介质制备氧化铝/六边形氮化硼(AL_2O_3-HBN / GFS / GFS / PTFE)复合材料,以及具有各种HBN填料含量的复合材料的电介质。 (0-20重量%)进行了研究。 结果表明,复合材料的导热系数显着增加,而热膨胀系数(CTE)逐渐降低,HBN含量增加。 具有20重量%的复合底物。%HBN的热导流率高为1.05 W m〜(-1)k〜(-1),这是纯PTFE的5.3倍。 这种组合物可以是高导热铜包层层压体中有希望的材料。

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  • 来源
    《Journal of materials science》 |2021年第18期|23325-23332|共8页
  • 作者单位

    Department of Materials Chongqing University of Technology Chongqing 400054 China;

    Department of Materials Chongqing University of Technology Chongqing 400054 China;

    Department of Materials Chongqing University of Technology Chongqing 400054 China;

    Jiaxing dead Electronics Co. LTD Jiaxing 314000 China;

    Jiaxing dead Electronics Co. LTD Jiaxing 314000 China;

    Jiaxing dead Electronics Co. LTD Jiaxing 314000 China;

    Department of Materials Chongqing University of Technology Chongqing 400054 China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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