机译:BI添加对低AG无铅焊点剪切强度和破坏机理的影响
Institute of Metal Research Chinese Academy of Sciences Shenyang 110016 China School of Materials Science and Engineering University of Science and Technology of China Shenyang 110016 China;
Institute of Metal Research Chinese Academy of Sciences Shenyang 110016 China School of Materials Science and Engineering University of Science and Technology of China Shenyang 110016 China;
Shenzhen Institute of Advanced Electronic Materials Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences Shenzhen 518055 China;
Institute of Metal Research Chinese Academy of Sciences Shenyang 110016 China Shenzhen Institute of Advanced Electronic Materials Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences Shenzhen 518055 China;
机译:铋添加对低银锡铜无铅焊料组织,性能和界面金属间化合物生长的影响
机译:稀土添加对Snagcu无铅焊点剪切强度的影响
机译:Ni,Bi浓度对低银SAC-Bi-Ni / Cu焊点组织和剪切行为的影响
机译:添加Bi和Ni对低银无铅焊点剪切强度的影响
机译:无铅焊点中铜锡(Cu-Sn)金属间化合物失效机理的表征和建模。
机译:石墨烯纳米片对Sn-20Bi-XGNS / Cu焊点润湿性和力学性能的影响
机译:建立对BGA封装中无铅焊点的影响力的估计方法(1)抗衰式焊接损失模式的依赖性损失载荷株的依赖性损失载荷株对PWB菌株的影响