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Rapid thermal annealing on the atomic layer-deposited zirconia thin film to enhance resistive switching characteristics

机译:原子层沉积氧化锆薄膜上的快速热退火,以增强电阻式开关特性

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摘要

The resistive switching random access memory (RRAM) device has received a great interest for the next-generation nonvolatile memory application, and resistive switching (RS) characteristics are mainly affected by conductive oxygen vacancies ([V_o]) within switching material. Various effective approaches with materials, doping, and thermal treatments have been attempted to achieve the stable RS behaviors. Particularly, thermal annealing is considered as an efficient knob to control [V_o] compared to other approaches. However, research on thermal treatment still lacks results and further research efforts are still needed to improve the RS characteristics of the devices. In this work we investigated the RS characteristics of Ti/ ZrO_x/Pt-structured RRAM device in comparison without and with postrapid thermal annealing (RTA) temperature range under oxygen ambient. The as-fabricated device with atomic layer-deposited ZrO_x switching layer exhibited conducting characteristics, which is related to a relatively high amount of [V_o] within switching medium. It indicates that moderate amount of [V_o] apparently determines the appropriate RS behaviors. With this regard, we modulated the [V_o] in ZrO_x thin films by employing RTA in the ranges of 500 °C to 800 °C at the oxygen ambient for 60 s. Unlike device without RTA, we observed the stable RS characteristics from device with RTA and device annealed at 700 °C exhibits the excellent bipolar RS characteristics such as higher R_(on)/R_(off), smaller cycle-to-cycle switching variation, better endurance, and longer retention among RTA conditions, indicating moderate amount of [V_o] formed within ZrO_x thin film layer. Moreover, increasing ALD ZrO_x thickness shows the further improvement in the RS characteristics and RTA on the thicker ZrO_x device still improves the RS behaviors. This research indicates that modulating [V_o] by fast thermal annealing on the ALD zirconia material can provide the proper RS characteristics of the non-volatile memory applications.
机译:电阻切换随机存取存储器(RRAM)设备已经为下一代非易失性存储器应用获得了极大的兴趣,并且电阻切换(RS)特性主要受切换材料内的导电氧空位([V_O])的影响。已经尝试使用材料,掺杂和热处理的各种有效方法来实现稳定的RS行为。特别地,与其他方法相比,热退火被认为是控制π的有效旋钮。然而,对热处理的研究仍然缺乏结果,仍然需要进一步的研究来改善设备的RS特性。在这项工作中,我们研究了Ti / ZrO_X / PT结构RRAM器件的RS特性,但在氧气环境下没有和具有Postrapid热退火(RTA)温度范围的比较。具有原子层沉积的ZrO_x开关层的由制造装置表现出传导特性,其与切换介质内的相对大量的π相关。它表明,中等量的[V_O]显然确定了适当的RS行为。鉴于这方面,我们通过在氧环境下在500℃至800℃的范围内使用500℃至800℃的RTA来调制ZrO_X薄膜中的π中的[V_O]。与无RTA的设备不同,我们观察到从带有RTA的装置的稳定RS特性,并且在700°C下退火的装置表现出优异的双极RS特性,例如更高的R_(ON)/ R_(OFF),循环到周期切换变化较小,更好的耐久性和更长的RTA条件保留,表示在ZrO_x薄膜层内形成的中等量的[V_O]。此外,增加ALD ZrO_X厚度表示RS特性的进一步改善,较厚的ZrO_X设备上的RTA仍然改善了RS行为。该研究表明,通过在ALD氧化锆材料上快速热退火调制[V_O]可以提供非易失性存储器应用的适当RS特性。

著录项

  • 来源
    《Journal of materials science》 |2020年第2期|903-909|共7页
  • 作者单位

    Department of Physics Khalifa University Abu Dhabi 127788 United Arab Emirates;

    Division of Materials Science and Engineering Hanyang University Seoul 04763 Republic of Korea;

    Division of Materials Science and Engineering Hanyang University Seoul 04763 Republic of Korea;

    Division of Materials Science and Engineering Hanyang University Seoul 04763 Republic of Korea;

    Division of Materials Science and Engineering Hanyang University Seoul 04763 Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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