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Growth and characterisation of wide-bandgap, I-VII optoelectronic materials on silicon

机译:硅上宽带隙I-VII光电材料的生长和表征

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gamma-CuCl is a wide-bandgap (E-g = 3.395 eV), direct bandgap, semiconductor material with a cubic zincblende lattice structure. Its lattice constant, a(CuCl) = 0.541 nm, means that the lattice mismatch to Si (a(Si) = 0.543 nm) is < 0.5%. gamma-CuCl on Si-the growth of a wide-bandgap, direct bandgap, optoelectronics material on silicon substrates is a novel material system, with compatibility to current Si based electronic/optoelectronics technologies.The authors report on early investigations consisting of the growth of polycrystalline, CuCl thin films with layer thicknesses of 100 nm to 1 mu m on Si (100), Si (111), and quartz substrates by physical vapour deposition. X-ray diffraction (XRD) studies indicate that CuCl grows preferentially in the (111) direction but an epitaxial alignment with the substrate is also detected to a lesser extent in the case of Si (100). Photoluminescence (PL) and Cathodoluminescence (CL) reveal a strong room temperature Z(3) excitonic emission at approximate to 387 nm. X-ray microanalysis and XRD are used to investigate the effect of heat treatments on the CuCl thin films after deposition in the temperature range of 50 to 430 degrees C, (melting point of CuCl approximate to 430 degrees C). It is a found that a reaction occurs with Si on heating above 250 degrees C forming SiCl4 and Cu. (C) 2005 Springer Science + Business Media, Inc.
机译:γ-CuCl是一种宽带隙(E-g = 3.395 eV),直接带隙的半导体材料,具有立方闪锌矿晶格结构。其晶格常数a(CuCl)= 0.541 nm,意味着与Si的晶格失配(a(Si)= 0.543 nm)<0.5%。硅上的γ-CuCl-硅衬底上宽带隙,直接带隙光电材料的生长是一种新颖的材料体系,与当前基于硅的电子/光电技术兼容。作者报告了早期研究,包括硅的生长通过物理气相沉积在Si(100),Si(111)和石英基板上形成厚度为100 nm至1μm的多晶CuCl薄膜。 X射线衍射(XRD)研究表明,CuCl在(111)方向上优先生长,但在Si(100)的情况下,与衬底的外延取向也被检测到较小。光致发光(PL)和阴极发光(CL)揭示了大约387 nm的强室温Z(3)激子发射。 X射线微分析和XRD用于研究在50至430摄氏度(CuCl的熔点约为430摄氏度)的温度下沉积后热处理对CuCl薄膜的影响。发现在加热到250℃以上时与Si发生反应,形成SiCl 4和Cu。 (C)2005年Springer Science + Business Media,Inc.

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