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首页> 外文期刊>Journal of materials science >Thermal annealing of porous silicon to develop a quasi monocrystalline structure
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Thermal annealing of porous silicon to develop a quasi monocrystalline structure

机译:多孔硅的热退火以形成准单晶结构

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摘要

Low porosity (~ 20-30%) porous silicon produced by electrochemical anodization was annealed in the temperature range 1000-1150 ℃ under pure hydrogen atmosphere and under hydrogen mixed with nitrogen in different proportions for a duration of 15-60 min. Porous silicon was transformed to quasi monocrystalline porous silicon (QMPS) in the temperature range 1050-1100 ℃ under pure hydrogen atmosphere. The crystallinity was confirmed by grazing incidence X-ray diffraction. Field emission scanning electron microscopic (FESEM) studies revealed that the surface layer is pore free with a few voids embedded inside the body. Atomic force microscopic (AFM) studies confirmed relatively smooth and uniform surfaces under the same annealing conditions. Our experimental results concluded that the recrystallization of porous silicon at 1100 ℃ and in presence of pure hydrogen exhibits lower reflection loss compared to bulk crystalline silicon. Also the electrical resistivity of QMPS makes it suitable for optoelectronic devices and solar cells.
机译:电化学阳极氧化法制得的低孔隙率(〜20-30%)多孔硅,在纯氢气气氛下,以不同比例的氢气与氮气混合,在1000-1150℃的温度范围内退火15-60分钟。在纯氢气氛下,在1050-1100℃的温度范围内将多孔硅转变为准单晶多孔硅(QMPS)。通过掠入射X射线衍射确认结晶度。场发射扫描电子显微镜(FESEM)研究表明,表面层无孔,体内嵌入了一些空隙。原子力显微镜(AFM)研究证实,在相同的退火条件下,表面相对光滑且均匀。我们的实验结果得出结论:与块状晶体硅相比,多孔硅在1100℃和纯氢存在下的重结晶表现出较低的反射损耗。 QMPS的电阻率也使其适用于光电器件和太阳能电池。

著录项

  • 来源
    《Journal of materials science 》 |2008年第5期| 305-311| 共7页
  • 作者单位

    IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;

    INSTM and Laboratorio di Chimica per le Tecnologie, Universita di Brescia, via Branze 38, Brescia 25123, Italy;

    School of Electronic Engineering, The Queen's University, Belfast BT7 1NN, UK;

    IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;

    IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;

    IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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