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机译:多孔硅的热退火以形成准单晶结构
IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;
INSTM and Laboratorio di Chimica per le Tecnologie, Universita di Brescia, via Branze 38, Brescia 25123, Italy;
School of Electronic Engineering, The Queen's University, Belfast BT7 1NN, UK;
IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;
IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;
IC Design & Fabrication Centre, Department of Electronics & Telecommunication Engineering, Jadavpur University, Kolkata 700032, India;
机译:通过多孔硅层的快速热退火获得的准单晶硅薄膜的结构,光学和电学性质
机译:准单晶多孔硅层相对于多孔硅的金属接触,电阻率和霍尔测量研究
机译:背面具有准单晶多孔硅层的薄硅太阳能电池的性能
机译:层转移准单晶多孔硅,用于薄硅太阳能电池
机译:分析激光热处理硅的热退火行为
机译:退火金包膜多孔硅的制备及热表征
机译:单晶和污渍蚀刻多孔硅的光致发光掺杂高温退火铕