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机译:焊接后的Sn37Pb和Sn3.8Ag0.7Cu焊点的冲击强度研究
College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, Peoples' Republic of China;
College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, Peoples' Republic of China;
College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, Peoples' Republic of China;
College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, Peoples' Republic of China;
College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, Peoples' Republic of China;
College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, Peoples' Republic of China;
机译:Sn37Pb和Sn3.8Ag0.7Cu焊点承受跌落测试的跌落性能比较
机译:不同位移速率下Cu / Sn37Pb / Cu钎焊接头的剪切强度和断裂行为
机译:等温时效处理Sn37Pb / Cu焊点的组织和剪切强度
机译:对SnAgnico VS SN3.8AG0.7CU C5无铅焊料合金的研究BGA焊点机械强度
机译:用共晶铅锡和无铅焊料对塑料球栅阵列,芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
机译:使用Sn纳米粒子增强焊膏焊接无源部件:对微观结构和关节强度的影响
机译:建立对BGA封装中无铅焊点的影响力的估计方法(1)抗衰式焊接损失模式的依赖性损失载荷株的依赖性损失载荷株对PWB菌株的影响
机译:颗粒冲击表面预处理对类似钢表面粘接强度影响的研究。