Sn3.8Ag0.7Cu和Sn37Pb焊点界面显微结构研究

摘要

利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了Sn3.8Ag0.7Cu(Sn7Pb)/Cu焊点在时效过程中的界面金属间化合物(IMC)形貌和成份.结果表明:150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu(Sn7Pb)/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小.50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn.之后利用透射电镜观察了Sn7Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显.%The present work studied the IMC morphology and composition at the interface of aged Sn3. 8Ag0. 7Cu (Sn37Ph) /Cu joints by SEM and TEM. It was found that IMC layer thickness and grain size increased with the increase of aging time. Aft5er 50 h aging,Sn3. 8Ag0. 7Cu (Sn37Ph) /Cu joints exhibited a duplex intermetallic compound structure; i. e. a layer of Cu6 Sn5 close to the solder and a layer of Cu3Sn adjacent to the Cu suhstrate. Finally the interface of FIB prepared Sn37Pb/Ni and Sn3. 8Ag0. 7Cu/Ni sample was examined under TEM. TEM images showed that the interfacial structure and IMC grain were evident.