Temperature measurement at flip chip solder joint during electromigration test

摘要

Measuring the real temperature of a flip chip solder joint during an electromigration test has been a problem because of its small size and the local Joule heating due to a large applied current. A unique method that employs the electrical resistance change in the junction line between two solder joints was introduced to determine the temperature of the solder joint. The change in resistance was converted into temperature using a thermal coefficient of resistance of the junction line. The method accurately measured temperatures of the solder joint within 2 K until the solder joint resistance change ratio reached 100% due to growth of an electromigration void.