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机译:Ag_3Sn聚集体对掺杂Sn58Bi焊点电迁移现象改善的影响
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong;
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong;
Department of Material Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan, China;
机译:Sn58Bi和Sn58Bi环氧焊点的电迁移行为
机译:原位观察EAG含有Ag_3SN相的电迁移诱导的Ag_3Sn相中的异常沉淀
机译:热迁移和电迁移耦合作用下Sn58Bi焊点中Sn原子的扩散行为
机译:焊点中预先存在的空隙对Cu / Sn58Bi / Cu接头电迁移行为的影响
机译:锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响,包括混合焊点在等温老化下的微观结构变化
机译:Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应
机译:Sn58Bi球栅阵列焊点中的热迁移和电迁移