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机译:Bi-Ag焊料合金的焊料/基材界面导热率和润湿角
Department of Materials Engineering, Federal University of Sao Carlos - UFSCar, Sao Carlos, SP 13565-905, Brazil;
Department of Mechanical Engineering and Mechanical Engineering, Santa Cecilia University (UNISANTA), Santos, SP 11045-040, Brazil;
Department of Manufacturing and Materials Engineering, University of Campinas - UNICAMP, Campinas, SP 13083-860, Brazil;
Department of Materials Engineering, Federal University of Sao Carlos - UFSCar, Sao Carlos, SP 13565-905, Brazil;
Department of Manufacturing and Materials Engineering, University of Campinas - UNICAMP, Campinas, SP 13083-860, Brazil;
Department of Manufacturing and Materials Engineering, University of Campinas - UNICAMP, Campinas, SP 13083-860, Brazil;
机译:Sn-0.7 wt%Cu-(0-0.1 wt%Ni)焊料合金的焊料/基板导热系数和润湿角的评估
机译:助焊剂变形对无助焊剂中Sn-3.5Ag焊料在Cu基体上的润湿特性和界面反应的影响
机译:用于高温焊接的Bi-Ag合金和Cu基底之间的接头的基底溶解度和剪切特性
机译:锡-锌基无铅焊料合金的润湿和界面反应可替代锡-铅焊料
机译:含铅和无铅焊料合金在电子包装中的金,钯,镍箔,引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
机译:锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
机译:热时效对锡基焊料合金与铜基体界面反应及金属间化合物形成和生长动力学的影响热时效对锡基软合金在铜基体上界面反应及形成动力学的影响金属间化合物的生长