机译:Cu-Sn和Ni-Sn瞬态液相键合,用于高温功率电子封装中的芯片连接技术应用
Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro,Yeonsu-gu, Incheon 21999, South Korea,Department of Metallurgical Engineering, Inha University,Incheon 22212, South Korea;
Department of Metallurgical Engineering, Inha University,Incheon 22212, South Korea;
Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro,Yeonsu-gu, Incheon 21999, South Korea,Critical Materials and Semiconductor Packaging Engineering, University of Science and Technology (UST),217 Gajeong-ro, Yuseong-gu, Daejeon 34113, South Korea;
机译:高温老化期间Ni-Sn瞬态液相烧结粘合的微观结构演化
机译:使用Ni和Sn-58Bi在空气中进行无压瞬态液相烧结,用于高温包装应用
机译:用于高温包装应用的瞬态液相银基焊料技术
机译:新一代半导体电力电子器件的高温耐耐耐力Ni-Sn瞬态液相烧结键合
机译:瞬态液相键合作为高温电力电子设备的连接技术。
机译:使用锌涂层的Ti-6Al-4V和Mg-AZ31合金的瞬时液相键合
机译:用于电子封装的低温瞬态液相键合