Electron backscattered diffraction was employed to observe the orientations of as-solidified Sn3.0Ag3.0Bi3.0In (SABI333) joints. Unlike other Sn-based solder joints consisting of only one grain or of tricrystals, the SABI333 joints typically consisted of polycrystals. The polycrystals were found to originate from Sn grains with deflections (> 15°) from the [110] and [ $$1ar {1}0$$ 1 1 ¯ 0 ] directions, i.e., the directions in which nucleation tends to occur, and the Bi and In atoms dissolved in the SnAg melt significantly enhanced the deflection. In addition, the orientations of the SABI333 solder joints were highly related to the solidification temperature. Higher solidification temperatures were associated with higher degrees of deviation. Additionally, two types of double tricrystals of Sn formed during solder joint solidification in the SABI333 joints. Although the characteristics of the twinning differed, both types had 80°–90° misorientations. One system featured four orientations of Sn grain twinning with a [100] or [010] axis, while the other one featured perpendicular tricrystals.
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机译:采用电子背散射衍射观察凝固的Sn3.0Ag3.0Bi3.0In(SABI333)接头的取向。与其他仅由一个晶粒或三晶组成的锡基焊点不同,SABI333焊点通常由多晶组成。发现多晶起源于Sn晶粒,它们从[110]和[$$ 1 bar {1} 0 $$ 1 1¯0]方向,即成核趋向的方向偏转(> 15°)发生,并且溶解在SnAg熔体中的Bi和In原子显着增强了挠度。此外,SABI333焊点的方向与固化温度高度相关。较高的凝固温度与较高的偏差程度有关。另外,在SABI333接头的焊点固化过程中,形成了两种类型的Sn双三晶体。尽管孪生的特性有所不同,但两种类型都有80°–90°的错误取向。一个系统的特征是锡晶粒以[100]或[010]轴孪晶的四个方向,而另一个系统则具有垂直的三晶。
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