机译:符合要求的硬Cu(Ni)-C纳米复合涂层
Edward E. Whitacre, Jr. College of Engineering, Dept. of Mechanical Engineering, Texas Tech University, USA;
Edward E. Whitacre, Jr. College of Engineering, Dept. of Mechanical Engineering, Texas Tech University, USA,Texas Tech University, Mechanical Engineering, Box 41021, 7th and Boston, Lubbock, TX 79409, USA;
nanocomposite; sputter deposition; Cu(Ni)-C; hard coatings;
机译:相容和硬质Cu(Ni)-C纳米复合涂层
机译:相容和硬质Cu(Ni)-C纳米复合涂层
机译:电沉积条件对Ni-B / SiC纳米复合镀层组织和硬度的影响
机译:Ni底层厚度对电镀生产的层压Ni / Cu涂层Cu硬度和特定磨损的影响
机译:涂层结构对硬和摩擦纳米复合涂层的硬度,摩擦和耐磨性的影响。
机译:镍-钨/金刚石纳米复合硬涂层的共电沉积
机译:符合要求的硬Cu(Ni)-C纳米复合涂层