机译:细间距可拉伸互连件的变形行为和拉伸诱导破坏的原位观察
IMEC, Kapeldreef 75, 3001, Leuven, Belgium Department of Materials Engineering, Katholieke Universiteit Leuven, 3000 Belgium;
IMEC, Kapeldreef 75, 3001, Leuven, Belgium;
IMEC-Centre for Microsystems Technology, 9052 Gent-Zwijnaarde, Belgium;
IMEC-Centre for Microsystems Technology, 9052 Gent-Zwijnaarde, Belgium;
IMEC-Centre for Microsystems Technology, 9052 Gent-Zwijnaarde, Belgium;
IMEC, Kapeldreef 75, 3001, Leuven, Belgium Department of Materials Engineering, Katholieke Universiteit Leuven, 3000 Belgium;
机译:间距对聚合物封装可拉伸电路的变形行为和拉伸诱导的破坏的影响
机译:封装对可拉伸互连的变形行为和破坏机理的影响
机译:原位扫描电子显微镜观察电迁移引起的30 nm½间距Cu互连结构中的空隙生长
机译:一种新型互连设计,具有高可拉伸性和可拉伸电子产品的微观距离能力
机译:使用细间距互连(≤10μm)的硅 - 互连织物上的异质整合(≤10μm)
机译:可拉伸电子器件的平面蛇形互连的有限变形模型
机译:对变形行为和拉伸诱导失效或细间距可拉伸互连的现场观察