Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

摘要

Electroless nickel (Ni-P) is a common surface finish used in the ball grid array (BGA) package and interfacial reactions between its surface finish and lead-free solders can form complex intermetallic compound (IMC) layers. The presence of minor elements in lead-free solders either intentionally added or due to impurity contamination during solder manufacturing, can affect the solder-joint performance. In this work, interfacial reactions between Ni-P surface finish and the Sn-Ag-Cu solders were modified by varying Ag and Cu contents and also by adding a small amount of minor elements such as phosphorus (P), indium (In), and germanium (Ge). A transmission electron microscope was used to determine the intermetallic layer phases, compositions, crystal structures, and void defects. Varying the solder alloy elements led to the modulation of voids formation.