首页> 外文期刊>Journal of intelligent material systems and structures >Electro elastic modeling of thin-laminated composite plates with surface-bonded piezo-patches using Rayleigh-Ritz method
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Electro elastic modeling of thin-laminated composite plates with surface-bonded piezo-patches using Rayleigh-Ritz method

机译:使用瑞利-里兹方法的表面粘结压电片的薄层复合板的电弹性建模

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摘要

Laminated composite panels are extensively used in various engineering applications. Piezoelectric transducers can be integrated into such composite structures for a variety of vibration control and energy harvesting applications. Analyzing the structural dynamics of such electromechanical systems requires precise modeling tools which properly consider the coupling between the piezoelectric elements and the laminates. Although previous analytical models in the literature cover vibration analysis of laminated composite plates with fully covered piezoelectric layers, they do not provide a formulation for modeling the piezoelectric patches that partially cover the plate surface. In this study, a methodology for vibration analysis of laminated composite plates with surface-bonded piezo-patches is developed. Rayleigh–Ritz method is used for solving the modal analysis and obtaining the frequency response functions. The developed model includes mass and stiffness contribution of the piezo-patches as well as the two-way electromechanical coupling effect. Moreover, an accelerated method is developed for reducing the computation time of the modal analysis solution. For validations, system-level finite element simulations are performed in ANSYS software. The results show that the developed analytical model can be utilized for accurate and efficient analysis and design of laminated composite plates with surface-bonded piezo-patches.
机译:层压复合板广泛用于各种工程应用中。压电换能器可以集成到这种复合结构中,以用于各种振动控制和能量收集应用。分析此类机电系统的结构动力学需要精确的建模工具,这些工具应适当考虑压电元件与层压板之间的耦合。尽管文献中先前的分析模型涵盖了具有完全覆盖的压电层的层压复合板的振动分析,但它们并未提供用于建模部分覆盖板表面的压电贴片的公式。在这项研究中,开发了一种用于振动分析的层压压电板的复合板的振动分析方法。 Rayleigh–Ritz方法用于求解模态分析并获得频率响应函数。所开发的模型包括压电贴片的质量和刚度贡献以及双向机电耦合效应。此外,开发了一种加速方法来减少模态分析解决方案的计算时间。为了进行验证,可在ANSYS软件中进行系统级的有限元模拟。结果表明,所开发的分析模型可用于精确有效地分析和设计具有表面粘结压电贴片的层合复合板。

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